DOWSIL SC 102
Harmonization Code : 3215907090 | Ink, whether or not concentrated or solid (excl. printing ink, printer/copier ink cartridges incorporating mechanical or electrical components, and solid ink in engineered shapes for printers/copiers)
Main features
- Moderate Thermal-Conductivity Compound
- One-Part Non-Curing Processing
- Critical-Component Heat Transfer
Product Description
DOWSIL™ SC 102 Compound is a one-part, white, non-curing, non-flowing thermally conductive silicone compound formulated with heat-conductive fillers to improve heat transfer between electronic components and heat sinks. Designed for thermal management in PCB system assembly modules, the compound helps dissipate heat from critical components in computer, power supply, and automotive applications. Its combination of moderate thermal conductivity, low bleed characteristics, high non-volatile content, and electrical insulation properties supports reliable thermal interface performance while simplifying application and rework processes.
Key features
- One-part formulation: Ready to use without mixing, ovens, or curing processes.
- 0.9 W/m·K thermal conductivity: Supports efficient heat transfer away from temperature-sensitive electronic components.
- Low bleed performance: A typical bleed value of 0.14% helps maintain interface stability during operation.
Applications / Suitable for
- PCB system assembly modules
- Computer electronics
- Power supply assemblies
- Automotive electronic systems
- Heat sink-to-component thermal interfaces
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of DOWSIL™ SC 102 Compound in its supplied condition.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | White | - | As supplied |
| Viscosity | 29,000 | cP | Typical value |
| Specific Gravity | 2.4 | - | Uncured |
| Bleed | 0.14 | % | Typical value |
| Non-Volatile Content | 99.7 | % | NVC |
| Thermal Conductivity | 0.9 | W/m·K | Typical value |
| Dielectric Strength | 2 | kV/mm | Typical value |
