DOWSIL EC-6601
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 86 dB 1 kHz to 8.5 GHz Shielding
- 2.7E-3 ohm-cm Volume Resistivity
- One-Part Room-Temperature Moisture Cure
Product Description
DOWSIL™ EC-6601 Electrically Conductive Adhesive is a one-part, moisture-curing silicone adhesive containing a silver filler blend for electrically conductive bonding, grounding, sealing, and electromagnetic compatibility applications. It cures through exposure to atmospheric moisture and can generally be processed at room temperature without a curing oven. The cured material combines a typical volume resistivity of 2.7E-3 ohm-cm with 86 dB shielding effectiveness from 1 kHz to 8.5 GHz. Its 194% elongation supports flexible joint designs while retaining adhesive, conductive, and sealing functions. Applications include EMC gaskets and seals, PCB grounding, electrical connections, and conductive assembly in automotive, communications, and consumer-electronics systems.
Key features
- EMC shielding and electrical conductivity: Provides 86 dB typical shielding effectiveness from 1 kHz to 8.5 GHz and a typical volume resistivity of 2.7E-3 ohm-cm after cure.
- Room-temperature moisture cure: The one-part formulation cures when exposed to moisture in the air, reducing the need for component mixing or a curing oven.
- Flexible cured joint: A typical elongation of 194% supports conductive adhesive, sealant, and gasket applications requiring greater joint flexibility.
Applications / Suitable for
- EMC adhesive, sealant, and gasket applications
- PCB grounding and electrical connections
- Automotive radar, camera, lidar, ECU, and battery assemblies
- 5G base stations and optical connectors
- Advanced cell assemblies and wireless chargers
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical values are provided for product evaluation and are not intended for use in preparing specifications.
| Property | Value | Unit | Method or condition |
|---|---|---|---|
| Component count | One | — | One-part moisture-cure adhesive |
| Color | Tan | — | As supplied |
| Initial extrusion rate | 2.20 | g/min | 0.275 MPa; 18 G × 1/2 in stainless-steel needle |
| Viscosity | 424 | Pa·s | Low shear, 1 s−1 |
| Viscosity | 55 | Pa·s | High shear, 10 s−1 |
| Skin-over time | 30 | min | Typical surface-cure time |
After-processing / final-state properties
Typical cured-material values are provided for product evaluation and are not intended for use in preparing specifications.
| Property | Value | Unit | Method or condition |
|---|---|---|---|
| Specific gravity | 3.37 | — | Cured material |
| Durometer hardness | 80 | Shore A | Cured material |
| Tensile strength | 1.61 | MPa | Cured material |
| Elongation | 194 | % | Cured material |
| Tack adhesion | 0.072 | MPa | Typical cured adhesion result |
| Lap shear adhesion | 1.30 | MPa | Aluminum 5052 substrate |
| Lap shear adhesion | 1.14 | MPa | Aluminum-clad substrate |
| Volume resistivity | 2.7E-3 | ohm-cm | Cured material |
| Thermal conductivity | 2.12 | W/m·K | Cured material |
| Shielding effectiveness | 86 | dB | Frequency range: 1 kHz–8.5 GHz |
