DOWSIL 3-4241
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Over One-Hour Working Time
- Conditional Primerless Adhesion
- 17 kV/mm Dielectric Strength
Product Description
DOWSIL™ 3-4241 Dielectric Tough Gel Kit is a two-part, 1:1 addition-cure silicone gel for potting and encapsulating printed circuit board system assemblies and electronic components. The blue and yellow components form a translucent green gel when properly mixed, providing a visible mixing check and a UV indicator for automated inspection. Its greater-than-one-hour working time supports flexible dispensing and assembly processes, while room-temperature cure or a two-minute heat cure at 125°C provides alternative production options. After cure, the toughened gel combines Shore 00 hardness of 63 with dielectric strength of 17 kV/mm, volume resistivity of 3.3 × 1014 ohm·cm, conditional primerless adhesion, and a UL 94 V-1 flammability rating.
Key features
- Extended working time: Pot life is greater than one hour at 25°C for processing flexibility.
- Room-temperature or accelerated cure: Typical cure schedules are 10.6 hours at 25°C or 2 minutes at 125°C.
- Toughened gel consistency: The cured material has a typical Shore 00 hardness of 63 for added mechanical strength while retaining gel characteristics.
- Electrical insulation properties: Typical dielectric strength is 17 kV/mm and volume resistivity is 3.3 × 1014 ohm·cm.
- Mixing and inspection indicators: Blue and yellow components turn translucent green when mixed, and the cured material includes a UV inspection indicator.
- Flame classification: The cured gel carries a UL 94 V-1 flammability rating.
Applications / Suitable for
- Potting and encapsulation of printed circuit board system assemblies
- Encapsulation and mechanical protection of electronic components
- Electrical insulation and environmental protection in boards and assemblies
- Battery-pack electronics requiring a soft, toughened silicone gel
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
General Properties
Electrical Properties
Additional Information
DOWSIL™ 3-4241 Dielectric Tough Gel Kit
A two-part addition-cure silicone gel for potting and encapsulating printed circuit board assemblies and electronic components. The product combines an extended working time with room-temperature or accelerated heat cure, toughened gel properties, electrical insulation, conditional primerless adhesion, and visual mixing and UV inspection indicators.
Two-component DOWSIL™ 3-4241 Dielectric Tough Gel Kit for controlled mixing and dispensing.
As-supplied properties
Typical values are provided for product evaluation and are not intended as guaranteed specifications.
| Property | Value | Unit | Condition or context |
|---|---|---|---|
| Product form | Two-part silicone gel | — | Addition-cure system |
| Mix ratio | 1:1 | — | Part A to Part B |
| Component colors | Blue and yellow | — | Forms a translucent green material when mixed |
| Part A viscosity | 425 | mPa·s | Typical base viscosity |
| Part B viscosity | 400 | mPa·s | Typical catalyst viscosity |
| Working time | >1 | hour | At 25°C; defined by doubling of initial mixed viscosity |
Mixing, dispensing, and cure
Meter and mix Parts A and B at a 1:1 ratio. The matched component viscosities support manual mixing for low-volume use or static and dynamic meter-mix dispensing for production processes. The mixed material changes from blue and yellow to translucent green, providing a visible indication of mixing.
Mixing, compatibility, and storage guidance
Avoid entraining air during mixing and dispensing. Vacuum degassing at greater than 28 inches Hg may be appropriate where a void-free protective layer is required. Addition-cure silicones may be inhibited by organotin compounds, sulfur-containing materials, unsaturated hydrocarbon plasticizers, and some solder-flux residues; verify questionable materials with a small-scale compatibility test. Store the product under the conditions shown on the container label and observe the labeled use-by date. Typical shelf life is 12 months at 25°C.
Cured properties
The following values are typical laboratory data and should not be treated as guaranteed production specifications or assembly-level design limits.
| Property | Typical value | Unit or condition |
|---|---|---|
| Color | Translucent green | Properly mixed material |
| Specific gravity | 0.98 | Cured |
| Durometer hardness | 63 | Shore 00 |
| Unprimed 180° peel strength | 3 | ppi |
| Dielectric strength | 17 | kV/mm |
| Dielectric constant | 2.60 / 2.61 | At 100 Hz / 100 kHz |
| Dissipation factor | 0.021 / 0.0002 | At 100 Hz / 100 kHz |
| Volume resistivity | 3.3 × 1014 | ohm·cm |
| Flammability classification | UL 94 V-1 | Agency listing |
Product applications
DOWSIL™ 3-4241 may be used where a soft, resilient silicone gel is required to surround electronic components while providing dimensional stability, electrical insulation, and mechanical cushioning.
Encapsulants and gels selection guide
Review DOWSIL™ silicone encapsulants and gels by product family, viscosity, hardness, cure system, working time, cure schedule, dielectric strength, and agency listing. The guide positions DOWSIL™ 3-4241 as an extended-working-life tough gel within the broader portfolio.
Technical support for DOWSIL™ 3-4241
Need help matching DOWSIL™ 3-4241 to your PCB assembly, dispensing equipment, cure process, adhesion requirements, or electrical-insulation needs? Krayden can help evaluate the available product data and identify the technical questions to address during application testing.
