DOWSIL 3-4155
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 60-Minute Gel Window
- Soft 60 G Gel for Dielectric Encapsulation
- 65 to 200 deg C Service Range
Product Description
DOWSIL™ 3-4155 HV Dielectric Gel Kit is a two-part, addition-cure silicone gel for potting and encapsulating printed circuit board system assemblies. The transparent green material has a 1:1 mix ratio and a medium mixed viscosity of 1875 mPa·s. It cures in 60 minutes at 25°C and may also be heat accelerated. After cure, the very soft gel provides electrical insulation, mechanical protection, environmental protection, and stress relief for electronic assemblies. It has a typical dielectric strength of 400 V/mil and is intended for operation from -65°C to 200°C.
Key features
- Soft dielectric encapsulation: The cured gel has a typical gel hardness of 60 g for protecting and insulating sensitive electronic assemblies.
- Room-temperature or accelerated cure: The addition-cure system cures in 60 minutes at 25°C and can be heat accelerated.
- Extended operating-temperature range: The cured material is intended to retain performance from -65°C to 200°C.
Applications / Suitable for
- Potting and encapsulation of printed circuit board system assemblies
- Electrical insulation of electronic assemblies
- Mechanical and environmental protection
- Stress relief for electronic components and interconnections
- Battery packs, boards, and assemblies
TDS, SDS & Technical Documents
Technical Specifications
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of the components and mixed material before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of parts | 2 | — | Two-part kit |
| Mix ratio | 1:1 | — | Ratio basis not stated on the supplied product page |
| Mixed viscosity | 1875 | mPa·s | Typical mixed-material value |
| Color | Transparent green | — | Mixed material |
| Working time | 8 | min | At 25°C; snap time |
After-processing / final-state properties
Typical properties of the cured silicone gel.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Gel hardness | 60 | g | Cured gel; typical value |
| Dielectric strength | 400 | V/mil | Equivalent reported value: 16 kV/mm |
| Dielectric constant | 2.96 | — | At 100 Hz and 100 kHz |
| Volume resistivity | 2.8 × 1014 | Ω·cm | Cured material; typical value |
| Thermal conductivity | 0.15 | W/m·K | Typical bulk-material value |
| Operational temperature | -65 to 200 | °C | Documented retained-performance range |
