COOLTHERM SC-6710
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 1.0 W/(m K) Thermal Encapsulation
- 20,000 cP Red Resin with Sc-6730 Processing
- 19.7 kV/mm Dielectric Strength
Product Description
CoolTherm® SC-6710 RED Silicone System combines SC-6710 RED thermally conductive silicone resin with a compatible hardener to form a two-component RTV encapsulation material for electrical and electronic assemblies. With SC-6730 hardener, the resin-to-hardener mix ratio is 100:5 by weight, the typical working life is 1–2 hours at 25°C, and the documented cure is 30–60 minutes at 65°C. The red resin has a typical 20,000 cP viscosity at 25°C and 2.15 specific gravity. Typical cured properties, stated as common across the supported hardeners, include 1.0 W/m·K thermal conductivity, 65 Shore A hardness, 19.7 kV/mm dielectric strength, and 1 × 1014 ohm-cm volume resistivity.
Key features
- Two-component, thermally conductive RTV silicone encapsulation system
- Low 20,000 cP resin viscosity for component encapsulation
- SC-6730 hardener supports a 100:5 weight ratio and 30–60 minute cure at 65°C
- Low-shrinkage, low-stress cured silicone positioning
- Typical 1.0 W/m·K thermal conductivity and 19.7 kV/mm dielectric strength
- Cured system positioned for repairability and rapid heat transfer
- Documented material-use range from -55°C to 200°C
Applications
- Thermally conductive electrical and electronic encapsulation
- Assemblies requiring low cured stress and rapid heat transfer
- High-temperature electronic parts within the documented material-use range
- Encapsulated assemblies where repairability is an important design consideration
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Additional Information
CoolTherm® SC-6710 RED Silicone System
SC-6710 RED is a low-viscosity thermally conductive silicone resin formulated for use with compatible hardeners. The requested SC-6730 configuration forms a two-component RTV encapsulation system positioned for low cured stress, rapid heat transfer, high-temperature use, and repairability in electrical and electronic assemblies.
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SC-6710 RED resin properties
The technical datasheet publishes the uncured properties of the SC-6710 RED resin. Mixed-system handling is determined by the selected hardener and its ratio.
| Property | Typical value | Context |
|---|---|---|
| Appearance | Red liquid | Thermally conductive silicone resin. |
| Viscosity at 25°C | 20,000 cP | Resin-only value; mixed viscosity is not published in DS3571. |
| Specific gravity at 25°C | 2.15 | DS3571 typical value. |
| SDS density | 2.19 g/cm³ | Current US safety-document value; preserve separately from the TDS specific gravity. |
| SDS flash point | ≥93°C | Setaflash closed cup. |
Premix the resin, add SC-6730 at 100:5 by weight, mix thoroughly, dispense, and cure
Thoroughly stir SC-6710 RED resin in its shipping container to restore uniform filler dispersion. Transfer the required resin quantity to a clean container, add SC-6730 hardener at 100:5 by weight, and mix thoroughly to ensure complete catalysation.
- Use weight-based metering; no SC-6730 volume ratio is published.
- Typical working life is 1–2 hours at 25°C.
- Apply using automatic meter/mix/dispense equipment.
- Cure for 30–60 minutes at 65°C.
- Count cure time after the material reaches 65°C and account for oven ramp and part thermal mass.
- Validate mixing, void control, fill geometry, cure, and final properties on the actual assembly.
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Thoroughly stir SC-6710 RED in its shipping container.
Add SC-6730 hardener using the documented weight ratio.
Mix thoroughly and apply using validated meter/mix/dispense equipment.
Hold at 65°C for 30–60 minutes after the material reaches temperature.
Storage and industrial handling
SC-6710 RED resin has a six-month shelf life from the date of manufacture when stored at 25°C in its original unopened container. Keep the container closed, upright, and in a well-ventilated area. The current US resin SDS is effective 15 January 2024 and notes possible mild eye and skin irritation, a flash point of at least 93°C, and potential formaldehyde generation from methylpolysiloxanes at approximately 150°C and above in oxygen-containing atmospheres. Review the current SC-6730 hardener SDS and all regional labels before mixing or use.
Thermal, mechanical, dimensional, and electrical properties
DS3571 states that the typical cured properties are the same regardless of the supported hardener used. These are bulk-material values and do not independently establish assembly-level thermal resistance, voltage rating, repairability, or service life.
| Property | Typical value | Context |
|---|---|---|
| Thermal conductivity | 1.0 W/m·K | Bulk cured-material value. |
| Hardness | 65 Shore A | Flexible cured silicone. |
| Tensile strength at 25°C | 800 psi | Bulk-material test result; test method is not stated in DS3571. |
| Elongation at break | 100% | Typical cured-material value. |
| Linear shrinkage | 0.002 in/in | Reported in the legacy technical bulletin; confirm inclusion in the approved current DS3571 revision. |
| Coefficient of thermal expansion | 8 × 10-5 in/in/°C | Reported in the legacy technical bulletin; confirm current test method. |
| Volume resistivity at 25°C | 1 × 1014 ohm-cm | Bulk electrical property; not a finished-assembly voltage rating. |
| Dielectric strength | 19.7 kV/mm (500 V/mil) | Breakdown property rather than design working voltage. |
| Dielectric constant | 5.3 at 25°C | Frequency is not stated in DS3571 Rev.5; legacy bulletin reports 100 kHz. |
| Dissipation factor | 0.02 at 25°C | Frequency is not stated in DS3571 Rev.5; legacy bulletin reports 100 kHz. |
Low-stress thermal encapsulation with repairability positioning
The SC-6710 RED system is directly positioned for electrical and electronic encapsulation requiring low stress, rapid heat transfer, high-temperature capability, and repairability. Final selection must account for component layout, fill depth, void tolerance, hardener choice, mix accuracy, cure, thermal path, voltage, creepage and clearance, surrounding materials, and the planned repair or removal method.
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Potting & Encapsulation Materials Catalogue — PC3002
PC3002 lists SC-6710 RED with SC-6731 hardener—not SC-6730—at 100:0.5 by weight, 12–16 hour room-temperature cure, 65 Shore A hardness, 19.7 kV/mm dielectric strength, and 1.0 W/m·K thermal conductivity.
Do not apply the catalogue's SC-6731 mix ratio or cure schedule to the requested SC-6730 configuration. DS3571 governs the hardener-specific processing shown on this page.
Validate the SC-6710 RED and SC-6730 encapsulation process
Krayden can help review hardener selection, 100:5 weight control, resin re-dispersion, meter/mix/dispense equipment, working life, void control, fill geometry, 65°C cure, thermal path, electrical insulation, temperature exposure, repair method, and assembly-level qualification.
