COOLTHERM SC-6705
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

Main features
- 55 to 205 deg C Service Range
- 2,500 cP Mixed Viscosity
- 17.7 kV/mm Dielectric Strength
Product Description
CoolTherm® SC-6705 Silicone Encapsulant is a two-component, addition-cure silicone system designed for applications requiring flexible encapsulation and high-temperature service. The resin and hardener mix at a 1:1 ratio by weight or volume to form a black liquid with a typical mixed viscosity of 2,500 cP at 25°C. After cure, the material forms a flexible elastomer with a documented operating-temperature range of -55°C to +205°C, typical thermal conductivity of 0.35 W/m·K, and electrical insulating properties.
Key features
- Broad operating-temperature range: Suitable for parts and devices operating from -55°C to +205°C.
- Low mixed viscosity: Provides a typical mixed viscosity of 2,500 cP at 25°C for encapsulation processing.
- Flexible electrical insulation: The cured system provides 100% elongation at break, typical dielectric strength of 17.7 kV/mm, and volume resistivity of 1 × 1014 ohm-cm at 25°C.
Applications / Suitable for
- Flexible silicone encapsulation requiring high-temperature service
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of CoolTherm SC-6705 resin, hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid / Off-white liquid / Black liquid | — | Resin / hardener / mixed system |
| Viscosity | 3,000 / 2,900 / 2,500 | cP | Resin / hardener / mixed system at 25°C; test method not stated |
| Specific gravity | 1.35 / 1.35 / 1.35 | — | Resin / hardener / mixed system; test conditions not stated |
| Mix ratio | 1:1 | Resin:hardener | By weight or volume |
| Working life | 1–2 | hours | Mixed system at 25°C; endpoint definition and test method not stated |
| Cure schedule | 2 hours / 24 hours | — | At 65°C / room temperature; time begins after the material reaches the target temperature |
| Shelf life | 6 | months | Each component when stored at 25°C in the original, unopened container |
After-processing / final-state properties
Typical cured properties of CoolTherm SC-6705 Silicone Encapsulant. The source does not state the cure schedule used to prepare the cured-property specimens. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature range | -55 to +205 | °C | Documented range for parts and devices; retained-property data are not stated |
| Thermal conductivity | 0.35 | W/m·K | Test method and temperature not stated |
| Hardness | 60 | Shore A | Test method not stated |
| Tensile strength | 2.07 (300) | MPa (psi) | Test method and test temperature not stated |
| Elongation at break | 100 | % | Test method and test temperature not stated |
| Volume resistivity | 1 × 1014 | ohm-cm | At 25°C; ASTM D257 |
| Dielectric strength | 17.7 (450) | kV/mm (V/mil) | ASTM D149; specimen thickness not stated |
| Dielectric constant | 3.2 | — | At 100 Hz; ASTM D150 |
| Dissipation factor | 0.005 | — | At 100 Hz; ASTM D150 |





















