COOLTHERM SC-309
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 0.9 W/(m K) Thermal Encapsulation
- Low-Viscosity Automated Meter-Mix Processing
- Room- or Heat-Cure Flexibility
Product Description
CoolTherm SC-309 Thermally Conductive Silicone Encapsulant is a two-component addition-cure system for electrical and electronic encapsulation. The 1:1 resin-to-hardener mix has a typical mixed viscosity of 3,600 cP at 25 deg C and a 30-minute working life, supporting automatic meter-mix-dispense processing. It cures for 24 hours at 25 deg C or can be heat cured in 15 minutes at 100 deg C or 10 minutes at 120 deg C. The cured encapsulant combines 0.9 W/(m K) thermal conductivity with low shrinkage, thermal shock resistance, and UL 94 V-0 flame retardancy.
Key features
- Thermally conductive encapsulation: Typical cured thermal conductivity is 0.9 W/(m K) by ISO 22007-2.
- Automated meter-mix processing: The 1:1 system has a typical mixed viscosity of 3,600 cP and a 30-minute working life at 25 deg C.
- Room- or heat-cure flexibility: Cure options include 24 hours at 25 deg C, 15 minutes at 100 deg C, or 10 minutes at 120 deg C.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical component and mixed-system properties. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance - resin / hardener / mixed | Gray / white / light gray | liquid | As supplied at 25 deg C |
| Viscosity - resin / hardener / mixed | 3,500 / 3,500 / 3,600 | cP | 25 deg C |
| Specific gravity | 1.67 | Resin, hardener, and mixed material | |
| Mix ratio - resin: hardener | 1:1 | By weight or volume | |
| Working life | 30 | minutes | Mixed material at 25 deg C |
| Shelf life | 6 | months | Each component at 5 to 30 deg C in original unopened containers |
After-processing / final-state properties
Typical cured properties under the stated methods. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.9 | W/(m K) | Hot Disc transient method, ISO 22007-2 |
| Coefficient of linear thermal expansion | 190 | ppm/deg C | ASTM C864 |
| Hardness | 34 | Shore A | ASTM D2240 |
| Tensile strength | 0.34 (50) | MPa (psi) | ASTM D412 |
| Moisture absorption | <0.5 | % | ASTM D570-81 |
| Volume resistivity | 4.3 x 10^13 | ohm cm | ASTM D257 at 25 deg C |
| Dielectric strength | 23.6 (600) | kV/mm (V/mil) | Typical cured value |
