COOLTHERM EP-6009

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM EP-6009

Main features

  • 2,600 cP Mixed Viscosity
  • 0.7 W/(m K) Thermal Encapsulation
  • Electrically Insulating Encapsulation

Product Description

CoolTherm® EP-6009 Epoxy Encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance. The black mixed material combines a typical viscosity of 2,600 cP at 25°C with a 60-minute working life, supporting application through handheld cartridges or automatic meter/mix/dispense equipment. After cure, the system provides typical thermal conductivity of 0.7 W/m·K together with electrical insulation and rigid mechanical properties.

Key features

  • Thermally conductive encapsulation: Provides a typical cured thermal conductivity of 0.7 W/m·K for potting applications requiring heat dissipation.
  • Low mixed viscosity: The mixed system has a typical viscosity of 2,600 cP at 25°C to support dispensing and flow during encapsulation.
  • Electrical insulation: Provides typical volume resistivity of 1.0 × 1015 ohm-cm at 25°C and dielectric strength of 500 V/mil after cure.

Applications / Suitable for

  • Thermally conductive potting applications requiring flame retardance
Product Family

COOLTHERM EP-6009

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Resin: Black Liquid | Hardener: Amber Liquid | Mixed: Black Liquid
Specific GravitySpecific Gravity
Resin: 1.65 | Hardener: 1.00 | Mixed: 1.52
Physical Properties
Viscosity (Part A)Viscosity (Part A)
(Resin) 17500 mPa.s
Viscosity (Part B)Viscosity (Part B)
(Hardener) 40 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
75 °C
Thermal ConductivityThermal Conductivity
0.7 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
0.5 kV/mm
Volume ResistivityVolume Resistivity
1.0 x 10^15 Ohms⋅cm
Mechanical Properties
ElongationElongation
at break 1.9 %
Chemical Properties
Moisture absorptionMoisture absorption
10 days @25°C 0.35 %

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the CoolTherm EP-6009 BLK resin, EP-6009 hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.

Property Value Unit Method / condition
Appearance Black liquid / Amber liquid / Black liquid EP-6009 BLK resin / EP-6009 hardener / mixed system
Viscosity 17,500 / 40 / 2,600 cP EP-6009 BLK resin / EP-6009 hardener / mixed system at 25°C; test method not stated
Specific gravity 1.65 / 1.00 / 1.52 EP-6009 BLK resin / EP-6009 hardener / mixed system; test conditions not stated
Mix ratio by weight 10:1 Resin:hardener CoolTherm EP-6009 BLK resin : CoolTherm EP-6009 hardener
Gel time 28 minutes Mixed system at 65°C; test method not stated
Working life 60 minutes Mixed system at 25°C; test method not stated
Cure time 2–4 hours At 65°C after the material reaches the target temperature
Shelf life 1 year Each component from date of manufacture when stored at 25°C in the original, unopened container
Technical properties

After-processing / final-state properties

Typical cured properties of the CoolTherm EP-6009 BLK resin and EP-6009 hardener system. The documented cure schedule is 2–4 hours at 65°C after the material reaches the target temperature. Values are not intended for specification purposes.

Property Value Unit Method / condition
Thermal conductivity 0.7 W/m·K Test method not stated
Coefficient of linear thermal expansion 47 ppm/°C Test method and temperature region not stated
Glass transition temperature 75 °C TMA
Hardness 90 Shore D Test method not stated
Tensile strength 48.3 (7,000) MPa (psi) ASTM D638
Elongation at break 1.9 % ASTM D638
Moisture absorption 0.35 % 10 days at 25°C; exposure medium and test method not stated
Volume resistivity 1.0 × 1015 ohm-cm ASTM D257 at 25°C
Dielectric strength 500 V/mil Test method and specimen thickness not stated

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