COOLTHERM EP-301
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 1.3 W/(m K) Thermal Encapsulation
- High-Fluidity Intricate-Circuitry Potting
- 19.7 kV/mm Dielectric Strength
Product Description
CoolTherm® EP-301 AD Epoxy Resin is a general-purpose, thermally conductive epoxy resin formulated for use with CoolTherm® EP-6010 Hardener. The two-component system combines high fluidity and air-release characteristics with a typical cured thermal conductivity of 1.3 W/m·K, supporting the potting of intricate circuitry and encapsulation of power devices. Available as a black or white liquid, the resin has a typical viscosity of 10,350 cP at 25 °C. When mixed with EP-6010 Hardener at 100:5.3 by weight, it cures to a rigid, electrically insulating material with dimensional stability from -65 to 155 °C.
Key features
- Thermally conductive encapsulation: Provides a typical cured thermal conductivity of 1.3 W/m·K when used with CoolTherm EP-6010 Hardener.
- High-fluidity epoxy system: Supports air release and material flow when potting intricate circuitry or encapsulating power devices.
- Electrical and temperature performance: Provides a typical dielectric strength of 19.7 kV/mm and dimensional stability from -65 to 155 °C.
Applications / Suitable for
- Potting intricate circuitry
- Encapsulating power devices
- Thermally conductive epoxy castings up to 200 g
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of CoolTherm EP-301 AD resin and the mixed EP-301 AD/EP-6010 system before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black or white liquid | — | CoolTherm EP-301 AD resin |
| Viscosity | 10,350 | cP | Resin at 25 °C; test method not stated |
| Specific gravity | 1.88 | — | Resin at 25 °C |
| Mix ratio | 100:5.3 | By weight | EP-301 AD resin : EP-6010 hardener |
| Working life | 2 | hours | Mixed system at 25 °C |
| Cure time | 24 or 2 | hours | 24 hours at 25 °C or 2 hours at 65 °C after the material reaches the target temperature |
| Shelf life | 1 | year | From date of manufacture when stored at 25 °C in the original, unopened container |
After-processing / final-state properties
Typical properties of the EP-301 AD and EP-6010 system after curing for 2 hours at 65 °C followed by 2 hours at 100 °C. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.3 | W/m·K | Cured bulk material; test method not stated |
| Dimensional-stability temperature range | -65 to 155 | °C | Documented dimensional-stability range; retained individual properties are not stated |
| Hardness | 87 | Shore D | Test method not stated |
| Tensile strength | 68 (9,890) | MPa (psi) | At 25 °C; test method not stated |
| Coefficient of linear thermal expansion | 26 | ppm/°C | Temperature region and test method not stated |
| Volume resistivity | 1 × 1015 | ohm-cm | At 25 °C; test method not stated |
| Dielectric strength | 19.7 (500) | kV/mm (V/mil) | Specimen thickness and test method not stated |
| Moisture absorption | 0.2 | % | After 10 days at 25 °C; exposure medium and test method not stated |
