CNP OM340
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Fine-Feature High-Speed Printing
- Eight-Hour Stencil Life
- Air or Nitrogen Reflow
Product Description
ALPHA OM-340 Solder Paste is a lead-free, no-clean, zero-halogen solder paste for fine-feature and high-throughput surface-mount PCB assembly. It supports stencil printing from 25 to 150 mm/s and an eight-hour stencil life at 25 deg C and 50% RH. The ROL0 flux system can be reflowed in clean-dry air or nitrogen and is formulated for low head-in-pillow defect rates and pin-testable residues. Under the stated process conditions, the paste supports reflow and coalescence on features down to 200 um. It is used with supported lead-free alloy configurations in production SMT assembly.
Key features
- High-Speed Stencil Printing: supports print speeds from 25 to 150 mm/s
- Eight-Hour Stencil Life: maintains an eight-hour stencil life at 25 deg C and 50% RH
- Flexible Reflow Atmosphere: supports reflow in clean-dry air or nitrogen
Applications
Fine-feature and high-throughput surface-mount PCB assembly using supported lead-free alloy configurations.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux classification | ROL0 | IPC J-STD-004B | |
| Tack-force change | Less than 1 | g/mm^2 | Over 24 h; 25 +/- 2 deg C; 50 +/- 10% RH; IPC J-STD-005 / TM-650 2.4.44 |
| Stencil life | 8 | hours | 25 deg C, 50% RH |
| Cold slump | Pass | No bridging at 0.20 mm gap and above; 25 deg C, 50% RH; IPC J-STD-005A | |
| Hot slump | Pass | No bridging at 0.25 mm gap and above; 150 deg C for 10 min; IPC J-STD-005A | |
| Print speed | 25 to 150 | mm/s | Process guideline |
| Refrigerated shelf life | 6 | months | 0 to 10 deg C |
After-processing / final-state properties
Electrical results apply only to the stated test conditions and methods.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Surface insulation resistance | >=1 x 10^8 | ohm | 7 days; 85 deg C/85% RH; IPC J-STD-004A |
| Surface insulation resistance | >=1 x 10^8 | ohm | 7 days; 40 deg C/90% RH; down to 100 um spacing; IPC J-STD-004B |
| Surface insulation resistance | >=1 x 10^8 | ohm | 7 days; 85 deg C/85% RH; IPC J-STD-004C |
| Surface insulation resistance | >=1 x 10^11 | ohm | 96 h; 35 deg C/85% RH; GR78-Core |
| Electromigration | Pass | 500 h; 65 deg C/85% RH; 10 V; final resistance > initial/10; GR78-Core |
