BERGQUIST TGF 3600
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 3.6 W/m-K Thermal Conductivity
- Sixty-Minute Application Window
- Soft Conforming Gap Fill
Product Description
BERGQUIST GAP FILLER TGF 3600 is a two-component, 1:1 silicone liquid gap filler for transferring heat between electronic components and housings or heat sinks. Its thixotropic mixed consistency supports precision dispensing, then flows under assembly pressure to conform around irregular topography and fill interface gaps. Room-temperature or accelerated heat cure produces a soft, low-modulus elastomer with 3.6 W/m-K thermal conductivity and Shore 00 hardness of 35. A 60-minute pot life at 25 deg C supports controlled application, while the cured material maintains vertical gap stability across a -60 to 200 deg C operating range. It is intended for thermal coupling rather than structural attachment.
Key Features
- 3.6 W/m-K heat transfer: Provides high bulk thermal conductivity after cure.
- Conforming low-modulus interface: Flows under assembly pressure and cures to Shore 00 hardness of 35.
- Ambient or accelerated cure: Cures at room temperature or on the specified heat schedule.
Applications
Thermal coupling of automotive electronics, PCB assemblies, discrete components, housings, and fiber-optic telecommunications equipment.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Uncured-system values; component and mixed colors are identified separately.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Part A: white; Part B: blue; mixed: blue | - | Visual |
| Mix ratio, Part A:Part B | 1:1 by weight; 1:1 by volume | parts | Two-component system |
| Mixed viscosity | 150,000 | mPa-s (cP) | ASTM D2196; Brookfield RV Helipath; spindle TF; 20 rpm; 25 deg C |
| Density | 3.0 | g/cc | ASTM D792 |
| Pot life | 60 | min | 25 deg C; time for viscosity to double |
| Shelf life | 5 | months | Unopened containers at 25 deg C and 50% RH |
After-processing / final-state properties
Cured-material values; thermal conductivity is a bulk material result under ASTM D5470.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 35 | Shore 00 | ASTM D2240; 30-second delay |
| Flammability | V-0 | UL 94 | Cured material |
| Dielectric strength | 275 | V/mil | ASTM D149 |
| Dielectric constant | 8.0 | - | ASTM D150 at 1,000 Hz |
| Thermal conductivity | 3.6 | W/(m-K) | ASTM D5470 |
| Operating temperature range | -60 to 200 | deg C | Cured material |
