ARALDITE AV170
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Up to 120 deg C Heat Resistance
- Up to 3 mm Gap Filling
- Heat-Resistant Gap-Filling Bonding
Product Description
ARALDITE® AV 170 is a thixotropic, single-component epoxy structural adhesive supplied as a paste for heat-cured bonding. It is recommended for a wide range of metals, temperature-resistant plastics and composites, with railway carriage identified as a product end use. The adhesive cures at 140–180°C, fills gaps up to 3 mm, and contains spacers that maintain a minimum 0.05 mm bondline; a 0.05–0.10 mm adhesive layer is recommended for greatest lap shear under the stated process. Published data include specified lap shear above 20 MPa at 80°C, very good peel strength, good chemical resistance and heat resistance to 120°C. The one-component format removes component mixing, while the thixotropic rheology supports controlled placement before assembly and clamping.
Key features
- One-component thixotropic paste: Applies directly without component mixing and supports controlled placement on prepared joint surfaces.
- Gap and bondline control: Fills gaps up to 3 mm and contains spacers that maintain a minimum 0.05 mm adhesive layer.
- Heat-cured structural performance: Cures at 140–180°C, is heat resistant to 120°C, and has specified lap shear strength above 20 MPa at 80°C.
Applications / Suitable for
- Railway carriage bonding and assembly
- Structural bonding of a wide variety of metal substrates
- Bonding temperature-resistant plastics and composite materials
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Product-form, handling and bondline-control data for the uncured single-component adhesive.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Physical form | Thixotropic paste | — | As supplied |
| Specific gravity | 1.15–1.20 | — | As supplied |
| Flash point | >100 | °C | As supplied |
| Gap-filling capability | Up to 3 | mm | Product feature |
| Spacer-controlled minimum bondline | 0.05 | mm | Built-in spacer feature |
| Recommended adhesive-layer thickness | 0.05–0.10 | mm | Normally provides the greatest lap shear under the stated process |
After-processing / final-state properties
Bonded-joint and cured-property values retain the stated cure and test conditions. Typical values are not guaranteed specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Lap shear strength at 80°C | >20 | MPa | Method A501; specified value |
| Lap shear strength at 23°C | 23–26 | MPa | Typical; 60 min cure at 140°C |
| Lap shear strength at 23°C | 26–30 | MPa | Typical; 60 min cure at 160°C |
| Lap shear strength at 23°C | 28–30 | MPa | Typical; 60 min cure at 180°C |
| Roller peel | 5.8 | N/mm | Typical; 30 min cure at 150°C |
| Roller peel | 6.6 | N/mm | Typical; 30 min cure at 180°C |
| Glass transition temperature | 129 | °C | Typical; DMA; 2 h cure at 150°C |
| Lap shear after thermal cycling | 26.6 | MPa | Typical; 100 cycles of 6 h from −30°C to 70°C; 60 min cure at 150°C; test at 23°C |
