ALPHA HF-1
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other

Main features
- Wide reflow profile window supporting air and nitrogen reflow with straight-ramp or soak profiles up to 300 °C.
- ROL0, halide-free flux system with residue suitable to remain on the circuit board without cleaning.
- Broad rework capability covering touch-up, hand soldering, BGA repair/re-balling, and QFN/LGA repair.
Product Description
ALPHA HF-1 Flux Gel is a rosin-based paste flux for surface-mount rework and other demanding electronic assembly operations. Its activator system can penetrate moderately tarnished surfaces, while the post-reflow residue can remain on the circuit board without cleaning. The flux supports both air and nitrogen reflow with straight-ramp or soak profiles up to 300 °C and is classified ROL0 according to IPC J-STD-004. Its paste form supports several application methods, including dispensing, screen printing, pin transfer, doctor blade, and dip coating. Documented rework uses include touch-up and hand soldering, BGA repair and re-balling, and QFN/LGA repair.
Key features
- Wide reflow profile window: Supports air and nitrogen reflow using straight-ramp or soak profiles up to 300 °C.
- ROL0, halide-free flux system: Classified ROL0 per IPC J-STD-004 and identified as halide-free based on formulation.
- Broad rework capability: Supports touch-up and hand soldering as well as BGA repair/re-balling and QFN/LGA repair.
Applications / Suitable for
- Surface-mount rework
- Touch-up and hand soldering
- BGA repair and re-balling
- QFN/LGA repair
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Selected physical and chemical properties of ALPHA HF-1 Flux Gel in its as-supplied paste state.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Smooth, amber paste | - | As supplied |
| Viscosity | 400 to 1000 | Poise | Malcom Viscometer, 5 rpm at 25 °C |
| Fineness of grind | <10 | µm | Physical property |
| Activity level | ROL0 | - | IPC J-STD-004 |
| Halide content | Halide-free | - | Based on formulation |
After-processing / final-state properties
Selected electrical test results for ALPHA HF-1 Flux Gel under the stated environmental test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| SIR | Pass, 2.5 x 1011 | ohms | Bellcore GR78-CORE; 96 hours at 35 °C/85% RH; pass ≥1 x 1011 ohm |
| Electromigration | Pass, 2.2 x 1010 | ohms | Bellcore GR78-CORE; 500 hours at 65 °C/85% RH, 10 V; pass = final > initial/10 |
| IPC SIR | Pass, 1.1 x 109 | ohms | IPC J-STD-004A; 7 days at 85 °C/85% RH; pass >108 ohms |
| HP electrochemical migration | Pass | - | HP ECM; 28 days at 50 °C/90% RH, 10 V |





















