ALPHA EF-6808HF

ALPHA EF-6808HF Liquid Soldering Flux is a ready-to-use, halogen-free, low-solids, alcohol-based no-clean flux for automated and manual circuit-board soldering. It is formulated for single- and dual-wave processes with SnPb and lead-free alloys and is especially effective on assemblies with high-density components. The flux provides strong hole fill with low bridging, icicles, and solder balls, while leaving uniform, transparent, tack-free residues that remain highly pin-testable. Spray application is recommended, with operating ranges for flux loading, preheat, conveyor speed, contact time, and solder-pot temperature. Typical as-supplied data include 4.0% solids, 0.793 +/- 0.005 specific gravity at 25 deg C, and an ROL0 designation.

Key Features

• High-density hole fill: Excellent hole fill with low bridging on high-density component assemblies.
• Low-defect wave soldering: Low bridging, icicles, and solder balls in SnPb and lead-free processes.
• Pin-testable residue: Uniform, transparent, tack-free residue remains highly pin-testable.

Applications

Automated and manual wave soldering with SnPb and lead-free alloys, including high-density component assemblies.