LOCTITE ABLESTIK NCF 218
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Non conductive Underfill film
- Enables fine pitch, narrow gap Cu pillar
- TSV, Die to die & Die to substrate
Product Description
LOCTITE ABLESTIK NCF 218 Non conductive Underfill film is specially formulated for Pb free, low κ, thin gap, large and thin die that are being used in advance flip chip applications. It is an ideal material for 3d die stacking in memory devices.
LOCTITE ABLESTIK NCF 218 is mainly used for Flip chips with bumps and pillars. Its main function is to fully encapsulate the tiny and fragile bumps/pillar interconnects and reinforce and destress the joints during temperature cycling tests. Additionally, it contains a fluxing agent that improves the interconnections between the bumps and the substrate.
LOCTITE ABLESTIK NCF 218 is suitable for die to die, die to wafer (TSV) or die to substrate applications. It is a 2 in 1, BMI based, heat curable yellow film that is typically used for Thermal compression bonding. The standard NCF 218 film has 18um layer thickness but it can also service thicknesses ranging from 15 to 40um.
Cure Schedule
- 30 minutes ramp to 175ºC, hold 2 hours @ 175°C
