ABLESTIK KS 0004

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK KS 0004

Main features

  • 0.01 ohm-cm Volume Resistivity
  • 2-Hour 60 deg C Cure
  • Conductive Bonding and Encapsulation Utility

Product Description

LOCTITE ABLESTIK KS 0004 KIT is a silver, two-component, 100% solids epoxy putty for conductive encapsulation, potting, and bonding. The resin and hardener are mixed at 100:8 by weight, providing a typical 35-minute pot life at 25°C. The material can be heat cured for 2 hours at 60°C or cured at room temperature, and a minimum 60°C cure is required to develop maximum electrical conductivity. Documented uses include forming electrical bonds where soldering heat is impractical, bonding RF shields, and preparing conductive surfaces.

Key Features

  • Silver, two-component epoxy putty with 100% solids content
  • 100:8 resin-to-hardener mix ratio by weight
  • Typical 35-minute pot life at 25°C for a 20 g mixed mass
  • Heat-cure and room-temperature cure options
  • Typical cured volume resistivity of 0.01 ohm·cm at 25°C
  • Typical aluminum-to-aluminum tensile shear strength up to 13.1 N/mm² after a 2-hour cure at 60°C

Applications / Suitable for

  • Conductive encapsulation and potting
  • Electrical bonds where soldering heat is impractical
  • RF shield bonding
  • Conductive surface preparation
Product Family

ABLESTIK KS 0004

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Silver
Chemistry TypeChemistry Type
Epoxy
Mix RatioMix Ratio
100 : 8
Electrical Properties
Volume ResistivityVolume Resistivity
0.01 Ohms⋅cm

Additional Information

Electrically Conductive Epoxy Encapsulant

LOCTITE ABLESTIK KS 0004 KIT

LOCTITE ABLESTIK KS 0004 KIT is a silver, two-component, 100% solids epoxy putty formulated for conductive encapsulation, potting, and bonding tasks. The mixed system combines a 35-minute pot life at 25 deg C with room-temperature or heat-cure options and develops a low typical volume resistivity after cure.

Silver epoxy puttyTwo-component system100% solidsElectrically conductive
Material Preparation

As-supplied properties

Component-specific and mixed-material values are kept separate to support accurate handling and process planning.

Property Value Unit Method / condition
Part A - LOCTITE ABLESTIK KE 4238 filler content 73 % As supplied
Part A - LOCTITE ABLESTIK KE 4238 specific gravity 3.025 - 25 deg C
Part A - LOCTITE ABLESTIK KE 4238 viscosity / form Paste - Brookfield RVF, spindle 5, 4 rpm, 25 deg C
Part B - LOCTITE STYCAST HD 3475 specific gravity 1.1 - 25 deg C
Part B - LOCTITE STYCAST HD 3475 viscosity 7,000 mPa s (cP) Brookfield RVF, spindle 5, 4 rpm, 25 deg C
Mixed material density 0.105 lb/in^3 As mixed
Mixed material pot life 35 minutes 25 deg C, 20 g mass
Preparation and Cure

Processing and cure

Thoroughly mix Part A in its original container before measuring. Combine resin and hardener at 100:8 by weight, then apply the mixed material within its typical 35-minute pot life at 25 deg C. Cure conditions are guideline recommendations and should be validated for the assembly, material mass, and actual equipment temperature.

Mix ratio: 100 parts resin to 8 parts hardener by weight.
Recommended heat cure: 2 hours at 60 deg C.
Alternate room-temperature cure: 24 hours at 25 deg C.
Conductivity development: A minimum cure temperature of 60 deg C is required for maximum electrical conductivity.
Storage and Handling

Store the unopened product in a dry location. The stated optimal storage range is 8 to 28 deg C, and each component has a typical shelf life of 365 days at 25 deg C from the date of shipment. Do not return material removed from a container to the original container. Consult the applicable safety information before handling either component.

Final Material Performance

Cured properties

Typical cured-property data are shown with their reported test context and are not presented as guaranteed design specifications.

Property Value Unit Method / condition
Volume resistivity 0.01 ohm cm 25 deg C; thin adhesive strip cured on glass. Minimum cure temperature of 60 deg C required for maximum conductivity.
Thermal conductivity 145 BTU in/(h ft^2 deg F) Typical bulk cured-material value; also reported as 500 x 10^-4 cal cm/(s cm^2 deg C).
Tensile shear strength 13.1 (1,900) N/mm^2 (psi) Aluminum-to-aluminum, cured 2 hours at 60 deg C.
Tensile shear strength 9.65 (1,400) N/mm^2 (psi) Aluminum-to-aluminum, cured 36 hours at 25 deg C.
Flammability Pass - Test method not identified in the supplied data.
IEEE operating class guide 105 deg C Reported guide to operating class; not presented as a universal service-temperature limit.
Documented Use Contexts

Applications

Documented use contexts include electrical connections, RF shield bonding, and conductive surface preparation.

Electrical Connections
Supports electrically conductive bonds where the heat associated with soldering is impractical for the assembly or components.
RF Shield Bonding
Provides a conductive adhesive route for attaching RF shields while forming the mechanical bond through the cured epoxy.
Conductive Surface Preparation
Can be applied to create a conductive surface in supported electronic assembly and encapsulation work.
Next steps

Evaluate LOCTITE ABLESTIK KS 0004 KIT for your application

Krayden can help review mix, cure, conductive-performance, substrate, and application requirements for LOCTITE ABLESTIK KS 0004 KIT. Discuss the intended assembly and process conditions with our technical team before establishing production parameters or acceptance criteria.

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