ABLESTIK KE 4238
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Conductive Bonding for Heat-Sensitive Assemblies
- 21 W/(m K) Thermal Conductivity
- 2-Hour 60 deg C Cure
Product Description
LOCTITE ABLESTIK KE 4238 is a silver, two-component, 100% solids epoxy adhesive designed for electrically conductive bonding. It is mixed at 100:8 by weight and provides a typical 35-minute pot life at 25°C. The system can be heat cured for 2 hours at 60°C or cured at room temperature, and it develops a typical cured volume resistivity of 0.01 ohm·cm at 25°C. Documented assembly uses include cold-solder connections for heat-sensitive components and RF shielding.
Key Features
- Silver, two-component electrically conductive epoxy adhesive
- 100% solids material
- 100:8 Component A-to-Component B mix ratio by weight
- Typical 35-minute pot life at 25°C for a 20 g mixed mass
- Recommended 2-hour heat cure at 60°C or alternate room-temperature cure
- Typical cured thermal conductivity of 21 W/(m·K)
Applications / Suitable for
- Cold-solder electrical connections for heat-sensitive components
- RF shielding attachment
- Electrically conductive bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Thermal Properties
Additional Information
LOCTITE ABLESTIK KE 4238
LOCTITE ABLESTIK KE 4238 is a silver, two-component, 100% solids epoxy adhesive for conductive assembly bonding. The mixed system combines a typical 35-minute pot life at 25 deg C with heat-cure and room-temperature cure options, and it is documented for cold-solder connections and RF shielding.
Typical as-supplied properties
The adhesive system consists of silver Component A and HD3475 hardener. Component-specific values are kept separate from mixed-material properties to support accurate measuring, mixing, and process planning. Values shown are typical.
| Material state | Property | Typical value | Unit | Method / condition |
|---|---|---|---|---|
| Component A - KE4238 | Appearance | Silver paste | - | As supplied |
| Component A - KE4238 | Specific gravity | 3.02 | - | 25 deg C |
| Component A - KE4238 | Viscosity / form | Paste | - | Brookfield RVF, spindle 5, 4 rpm, 25 deg C |
| Component B - HD3475 | Specific gravity | 1.1 | - | 25 deg C |
| Component B - HD3475 | Viscosity | 7,000 | mPa s (cP) | Brookfield RVF, spindle 5, 4 rpm, 25 deg C |
| Mixed material | Viscosity / form | Paste | - | 25 deg C |
| Mixed material | Pot life | 35 | minutes | 25 deg C, 20 g mass |
Mixing, application and cure
Clean the surfaces to be bonded and thoroughly mix Component A in its container before measuring. Weigh Components A and B at 100:8 by weight, mix until homogeneous, and apply the adhesive within its typical working period. The specified mix ratio should not be changed to adjust cure rate because off-ratio mixing can degrade properties.
Storage conditions and shelf life
Store the unopened product in a dry location at the stated optimal storage temperature of 25 deg C. Component A and Component B each have a typical shelf life of 365 days at 25 deg C. Keep containers closed, prevent contamination, and do not return removed material to the original container. Consult the applicable safety information before handling.
Typical cured properties
The values below are typical laboratory data and should be interpreted with their stated test methods, substrates, and cure conditions. They are not guaranteed production specifications or universal joint-design allowables.
Typical cured bulk value. Method listed as ASTM D1674.
Typical cured value at 25 deg C.
Typical density measured using ASTM D792.
| Property | Typical result | Unit | Method / condition |
|---|---|---|---|
| Cured density | 2.91 | g/cm^3 | ASTM D792 |
| Thermal conductivity | 21 | W/(m K) | ASTM D1674 |
| Volume resistivity | 0.01 | ohm cm | 25 deg C |
| Tensile lap shear strength | 13.1 | N/mm^2 (1,900 psi) | ASTM D1002; aluminum-to-aluminum; cured 2 hours at 60 deg C |
| Tensile lap shear strength | 9.6 | N/mm^2 (1,400 psi) | ASTM D1002; aluminum-to-aluminum; cured 36 hours at 25 deg C |
| Flammability | Pass | - | ASTM D635 |
Documented conductive assembly uses
LOCTITE ABLESTIK KE 4238 is used for conductive assembly bonding, including documented cold-solder connection and RF shielding applications. Selection and process validation should remain specific to the intended substrates, geometry, cure route, and electrical requirements.
Cold-solder connections
Provides an electrically conductive adhesive route for heat-sensitive components where hot-soldering is impractical.
RF shielding
Supports conductive attachment of RF shielding elements where the bonded connection also requires electrical continuity.
Conductive assembly bonding
Combines adhesive bonding with a conductive cured path for appropriately designed and validated electronic assemblies.
Evaluate LOCTITE ABLESTIK KE 4238 for your conductive bonding process
Krayden can help review substrate preparation, mix control, dispensing, cure selection, bondline design, and electrical or thermal evaluation requirements for LOCTITE ABLESTIK KE 4238. Application trials should confirm performance in the intended assembly, process equipment, and service conditions.
