ABLESTIK FDA 2

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK FDA2

Main features

  • 1.20 x 10^14 ohm-cm Volume Resistivity
  • 3-Hour Working Window
  • 1,800 psi Aluminum Lap Shear

Product Description

LOCTITE® ABLESTIK FDA 2 BIPAX is a two-part, electrically insulating epoxy adhesive for medical-device bonding applications. Formerly known as TRA-BOND FDA2, the amber, medium-viscosity system mixes at 100:100 by weight and provides a typical pot life of 45 minutes and work life of 3 hours. It can be cured for 24 hours at 25°C or accelerated for 1 to 4 hours at 65°C. The cured adhesive has a documented operating-temperature range of -70 to 145°C, typical volume resistivity of 1.20 × 1014 ohm-cm at 25°C, and aluminum-to-aluminum lap shear strength of 1,800 psi.

Key features

  • Electrically insulating: Typical cured properties include volume resistivity of 1.20 × 1014 ohm-cm at 25°C and dielectric strength of 420 V/mil.
  • Medium-viscosity processing: Typical mixed viscosity of 14,000 mPa·s at 25°C supports controlled adhesive application.
  • Room-temperature or heat cure: Guideline schedules include 24 hours at 25°C or 1 to 4 hours at 65°C.

Applications / Suitable for

  • Catheters
  • Hearing aids
  • Dental products
  • Other biomedical instruments and devices
Product Family

ABLESTIK FDA 2

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Chemistry TypeChemistry Type
Epoxy
ColorColor
Amber
Mix RatioMix Ratio
100 : 100
Pot LifePot Life
45 minutes
Specific GravitySpecific Gravity
1.12
Work life @25°CWork life @25°C
3 hours
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
54 °C
Operating TemperatureOperating Temperature
-70 to 145 °C
Physical Properties
Thixotropic indexThixotropic index
1.0
ViscosityViscosity
14000 mPa.s
Mechanical Properties
ElongationElongation
9 %
Electrical Properties
Volume ResistivityVolume Resistivity
1.20×10¹⁴ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties and processing characteristics of the mixed two-part adhesive before cure.

Property Value Unit Method / condition
Technology Epoxy Two-part resin and hardener system
Color Amber Mixed adhesive
Mix ratio — resin:hardener 100:100 by weight Resin-to-hardener ratio
Mixed viscosity 14,000 mPa·s (cP) Brookfield RV, spindle 7, 10 rpm at 25°C
Thixotropic index 1.0 Test details not stated
Specific gravity — mixed 1.12 Mixed adhesive
Reactive solids content 100 % Typical value
Pot life 45 minutes Test conditions and endpoint not stated
Work life 3 hours Test conditions and endpoint not stated
Cure schedule 24 hours or 1–4 hours 24 hours at 25°C or 1–4 hours at 65°C; guideline recommendations
Optimal storage 27 °C Store unopened in a dry location; package labeling governs applicable storage information
Technical properties

After-processing / final-state properties

Typical properties and performance data for the cured adhesive. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Operating-temperature range -70 to 145 °C Documented product range
Coefficient of thermal expansion 5.30 × 10-5 cm/cm/°C Method, temperature region, and cure condition not stated
Glass-transition temperature 54 °C Ultimate Tg; method and cure condition not stated
Hardness 80 Shore D Method and cure condition not stated
Elongation 9 % Method and cure condition not stated
Volume resistivity at 25°C 1.20 × 1014 ohm-cm Test method and specimen configuration not stated
Dielectric strength 420 V/mil Test method, thickness, and conditioning not stated
Dielectric constant 3.4 At 25°C and 1 kHz
Dissipation factor 0.02 At 25°C and 1 kHz
Lap shear strength — aluminum to aluminum 1,800 psi Substrate preparation, bondline, cure condition, test method, and test temperature not stated

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