ABLESTIK ECF 561E-1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrically Conductive Bonding
- Flexible Cured Adhesive
- 1.6 W/(m K) Thermal Conductivity
Product Description
LOCTITE® ABLESTIK ECF 561E-1 is a silver-filled, electrically conductive rubberized epoxy film for substrate-attach applications. Its glass-fabric carrier supports a controlled 1 mil carrier thickness, while the flexible film is intended for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, the adhesive can function as an electrical ground plane and provides conductivity in the x, y, and z axes, including across frequencies extending into the gigahertz range. Guideline heat-cure schedules are 1 hour at 150°C or 2 hours at 125°C under continuous pressure.
Key features
- Multidirectional electrical conductivity: Conductive in the x, y, and z axes, with typical cured bond-joint resistance of 0.001 ohm per 0.5 in².
- Flexible rubberized epoxy film: Intended for bonding adherends with severely mismatched coefficients of thermal expansion.
- Thermally conductive substrate attach: Typical thermal conductivity is 1.6 W/(m·K) at 121°C, with the bonded film able to serve as an electrical ground plane.
Applications / Suitable for
- Substrate-attach applications
- Bonding materials with severely mismatched coefficients of thermal expansion
- Electrically conductive ground-plane bonding
- Die-cut conductive adhesive-film assemblies
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical construction, storage, and cure information for the conductive adhesive film before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Rubberized epoxy film | — | Conductive dry-film product |
| Appearance | Grey film | — | As supplied |
| Carrier type | Glass fabric | — | Adhesive-film construction |
| Carrier thickness | 1 | mil | Nominal carrier thickness |
| Filler type | Silver | — | Conductive filler |
| Shelf life | 365 | days | At -40°C, from date of manufacture |
| Cure schedule | 1 hour or 2 hours | — | 1 hour at 150°C or 2 hours at 125°C; maintain 2–10 psi pressure during cure |
After-processing / final-state properties
Typical cured-film properties and bonded-joint performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 47 | °C | DMTA; cure condition not stated |
| Coefficient of thermal expansion — below Tg | 100 | ppm/°C | Below Tg; method and cure condition not stated |
| Coefficient of thermal expansion — above Tg | 380 | ppm/°C | Above Tg; method and cure condition not stated |
| Thermal conductivity | 1.6 | W/(m·K) | At 121°C; method, thickness, and orientation not stated |
| Weight loss | 0.55 | % | At 300°C; method and exposure duration not stated |
| Bond-joint resistance | 0.001 | ohm/0.5 in² | Bonded-joint result; substrate and test method not stated |
| Lap shear strength — aluminum to aluminum | 2,000 | psi | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
| Lap shear strength — gold to gold | 2,100 | psi | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
