ABLESTIK 976-1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrically Conductive Thermal Interface
- 2.1 W/(m K) Thermal Interface
- 1:1 Meter-Mix Processing
Product Description
LOCTITE® ABLESTIK 976-1 is a silver-filled, electrically conductive epoxy adhesive designed for circuitry formation and component attachment on non-rigid substrates. The flexible adhesive can be applied by automatic dispensing, screen printing, or hand probe and is available either premixed and frozen or as a two-component system with a 1:1 mix ratio. Typical cured properties include thermal conductivity of 2.1 W/(m·K), volume resistivity of 0.0002 ohm-cm, and aluminum-to-aluminum lap shear strength of 5.17 N/mm² at 25°C. Guideline heat-cure options include 2 hours at 125°C, 4 hours at 100°C, or 1 hour at 150°C.
Key features
- Electrically conductive: Typical cured volume resistivity is 0.0002 ohm-cm.
- Flexible adhesive system: Designed for use on non-rigid substrates in circuitry formation and component attachment.
- Multiple application and supply formats: Suitable for automatic dispensing, screen printing, or hand-probe application and supplied premixed frozen or as a 1:1 two-component kit.
Applications / Suitable for
- Circuitry formation on non-rigid substrates
- Electronic component attachment
- Automatic dispensing
- Screen-printing and hand-probe application
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical properties, storage conditions, and guideline cure schedules for the adhesive before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Electrically conductive adhesive |
| Appearance | Silver paste | — | As supplied |
| Supply format | Premixed frozen or two-component | — | Two-component kit uses a 1:1 mix ratio |
| Mix ratio | 1:1 | — | Part A:Part B for two-component kits |
| Viscosity | 9,000 | mPa·s (cP) | Brookfield CP51, 5 rpm at 25°C |
| Specific gravity | 4.1 | — | SDS physical-property value |
| Work life | 8 | hours | At 25°C; endpoint is a 25% increase in viscosity |
| Storage life — premixed frozen | 365 | days | Continuously stored at -40°C |
| Storage life — two-component kit | 365 | days | At 25°C |
| Cure schedule | 2 hours, 4 hours, or 1 hour | — | 2 hours at 125°C, 4 hours at 100°C, or 1 hour at 150°C; guideline recommendations |
After-processing / final-state properties
Typical cured-material properties and bonded-joint performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 66 | °C | TMA; cure condition not stated |
| Coefficient of thermal expansion — below Tg | 73 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 390 | ppm/°C | TMA; cure condition not stated |
| Thermal conductivity | 2.1 | W/(m·K) | Test method, temperature, bondline thickness, and orientation not stated |
| Weight loss at 300°C | 0.2 | % | Test method and exposure duration not stated |
| Volume resistivity | 0.0002 | ohm-cm | Test method, geometry, and cure condition not stated |
| Lap shear strength — aluminum to aluminum | 5.17 (750) | N/mm² (psi) | Tested at 25°C; substrate preparation, bondline, cure condition, and test method not stated |
