LOCTITE ABLESTIK 8900NCM
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Low resin bleed
- Non Conductive
- No CAT3 CMR substances
Product Description
LOCTITE ABLESTIK 8900NCM epoxy die attach adhesive is specially formulated for small to medium size packages. It is a white, heat curable, non conductive adhesive with low resin bleed and low voiding during the curing process. It has moderate stress absorbing capabilities and can dispense with minimal tailing and stringing.
LOCTITE ABLESTIK 8900NCM is PTFE filled and is suitable for bare, Ag plated and Palladium plated copper leadframes. Actual performance will depend on die size, aspect ratio and package design. This product is a green material, containing no CAT3 CMR substances. It is successfully used in Automotive applications as a low modulus, low stress solution on leadframes and can also be used for die stacking.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
ABLESTIK 8900
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Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
LOCTITE ABLESTIK 8900NC (no M) is better suited for and has been proven to have good adhesion on Gold plated/Au flash substrates.
