LOCTITE ABLESTIK 8600
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Thermally conductive
- Low bleed
- Compatible for use with Ag, PPF and Cu
Product Description
LOCTITE® ABLESTIK 8600 die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material is not recommended for high density matrix leadframes with greater than 500 pads.
LOCTITE® ABLESTIK 8600 is a snap curable, acrylate die attach adhesive that is electrically and thermally conductive. It exhibits low bleed and improved JEDEC performance and is compatible with Ag, PPF and CU sbstrates. Typically used for small SO and QFN package types.
Snap Cure Schedule (7 Zone)
- Temp per zone: 150ºC, 160ºC, 180ºC, 220ºC, 220ºC, 220ºC, 220ºC
- Total Time : 60 seconds
- N2 Temp : 150ºC
Oven Cure
- 30 minute ramp to 175°C + 15 minutes @ 175°C , in N2 or air
For non-PFAS version please visit LOCTITE® ABLESTIK ABP 8600NP
ABLESTIK 8600
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