LOCTITE ABLESTIK 8302
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Excellent peel strength
- Low moisture absorption
- Improved JEDEC performance
Product Description
LOCTITE® ABLESTIK 8302 electrically conductive die attach adhesive is designed for high reliability package applications. It is a heat cured, silver filled die attach paste suited for PPF, Bare copper and Ag plated Cu leadframes.
LOCTITE® ABLESTIK 8302 contains no spacers (and there are no plans to create a spacer version) and is a multi purpose die attach paste, suitable for broad application spaces with relatively low modulus (2000 MPa @ RT, 180 MPa @ 250C). It is designed for QFP and SO devices with broad die size range (1x1 to 8x8mm) using Bare Cu, Ag spot and PPF leadframes.
Cure Schedule
- 30 minute ramp from 25°C to 175°C + 60 minutes @ 175°C
- 45 minute ramp from 25°C to 200°C + 60 minutes @ 200°C
ABLESTIK 8302
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Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Loctite Ablestik 8302 MSL Testing results
