LOCTITE ABLESTIK 8006NS
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- B-stageable
- Smaller die sizes
- Improved printability
Product Description
LOCTITE ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing.
LOCTITE ABLESTIK 8006NS can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt. It is more suitable for smaller die applications.
B-stage cure
- 1 hour @100°C
Cure Schedule
- 2 hours @160°C
ABLESTIK 8006NS
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