LOCTITE ABLESTIK 2025DSI
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- With Spacers
- For mother die in array packaging
- 260ºC reflow capability for Pb-free applications
Product Description
LOCTITE ABLESTIK 2025DSI is a Silica filled die attach adhesive with excellent dispense capabilities, designed for use in array packaging while it can also be used for ASIC attach. Even though its properties are exceptional, Silica has the downside of potentially scratching the dies. That's why manufacturers tend to prefer the QMI range of products for stacking.
LOCTITE ABLESTIK 2025DSI has great adhesion on PPF leadframes, excellent die sheer strength and MSL performance, something that makes it the product of choice for the first (mother) die and a great spacer filled product for laminates. 2025DSIS25 has 25um spacers. It performs excellently for these applications and it compliments nicely the QMI products on die stacking applications. This product has low to medium modulus and can also be used for individual large die.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
