LOCTITE ABLESTIK 16-1

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE ABLESTIK 16-1

Main features

  • Electrically conductive
  • Room temperature or heat cure
  • Good adhesion

Product Description

LOCTITE ABLESTIK 16-1 is a silver-filled epoxy adhesive designed for general-purpose electrical bonding applications. Supplied as a silver-colored paste, it offers dual-cure flexibility, curing at room temperature over 24 hours or accelerated with heat schedules as short as 30 minutes at 95°C. The adhesive is electrically conductive with low volume resistivity, making it suitable for applications requiring a reliable conductive bond path. It provides good adhesion to metals and a practical 2-hour work life at 25°C, and is supplied premixed and frozen for convenient dispensing after thawing.

Key features

  • Electrically conductive: Silver-filled formulation with low volume resistivity (≤0.005 ohm-cm).
  • Room temperature or heat cure: Cures at 25°C in 24 hours, or faster with heat-accelerated schedules.
  • Good adhesion: Lap shear strength of 6.89 N/mm² (1,000 psi) on aluminum at 25°C.

Applications / Suitable for: General assembly applications requiring electrically conductive bonding.

Product Family

ABLESTIK 16-1

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Silver
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
57 °C
Thermal ConductivityThermal Conductivity
2 W/m.K

Additional Information

Electrically Conductive Epoxy Adhesive

LOCTITE ABLESTIK 16-1

LOCTITE ABLESTIK 16-1 is a silver-filled, two-component epoxy adhesive for general-purpose bonding where electrical conductivity is required. The material combines a 2-hour work life at 25 deg C with room-temperature or heat cure options, and the cured adhesive provides low volume resistivity together with documented lap shear strength on aluminum.

Silver-filled epoxyTwo-componentElectrically conductiveLow volume resistivityGood adhesion
As supplied

Material and working properties

Key as-supplied characteristics support evaluation of handling, dispensing logistics, and available working time before cure.

System
Two-component epoxy

Silver-filled adhesive available premixed and frozen in a variety of sizes or in pound kits.

Work life
2 hours

Reported at 25 deg C.

Appearance and filler
Silver

Both the product appearance and filler type are reported as silver.

Processing

Thawing, application, and cure

The listed cure profiles are guideline recommendations. Actual cure time and temperature may vary with the application, curing equipment, oven loading, and actual oven temperature.

Thawing: Allow the container to reach room temperature. Keep syringes vertical while thawing, and do not open the container until the contents reach 25 deg C. Remove any collected moisture from the container before opening.
Application: Apply adhesive as required, assemble the bond, and cure using one of the recommended schedules. For best results, use within 2 hours after removal from the freezer.
Primary cure schedule: 30 minutes at 95 deg C.
Alternate cure schedules: 1 hour at 65 deg C or 24 hours at 25 deg C.
Storage and Handling

Store the unopened product in a dry location. Optimal storage is -40 deg C, with a reported shelf life of 183 days at -40 deg C from the date of manufacture. Do not re-freeze after thawing. Material removed from the original container should not be returned because contamination can occur.

Final properties

Cured material performance

These are typical reference values and are not product specifications. Test method and condition context is retained where reported.

Volume resistivity
<=0.005 ohm-cm

Cured-material electrical property.

Aluminum lap shear
6.89 N/mm^2

1,000 psi; aluminum-to-aluminum bonds tested at 25 deg C.

Thermal conductivity
2.0 W/(m K)

Reported at 121 deg C.

Glass transition temperature
57 deg C

Reported by TMA.

Property Value Unit Method / condition
Hardness 85 Shore D Cured material
Coefficient of thermal expansion, below Tg 70 ppm/deg C TMA; below Tg
Coefficient of thermal expansion, above Tg 300 ppm/deg C TMA; above Tg
Glass transition temperature (Tg) 57 deg C TMA
Thermal conductivity 2.0 W/(m K) 121 deg C
Weight loss 0.1 % TGA; 150 deg C
Weight loss 0.7 % TGA; 250 deg C
Volume resistivity <=0.005 ohm-cm Cured material
Lap shear strength, Al to Al 6.89 (1,000) N/mm^2 (psi) Tested at 25 deg C
Next steps

Evaluate LOCTITE ABLESTIK 16-1 for conductive bonding

Krayden can help review substrate selection, bond geometry, thawing and frozen-storage logistics, work-life requirements, cure schedule, and the electrical or mechanical properties relevant to evaluating LOCTITE ABLESTIK 16-1 in a general assembly process. Discuss your application conditions and technical data needs with the Krayden team.

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