LOCTITE ABLESTIK 12-1

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE ABLESTIK 12-1

Main features

  • Thermally Conductive Bonding
  • Reworkable Bonding Material
  • Up to 200 deg C Service

Product Description

LOCTITE ABLESTIK 12-1 is a one-part, heat-cure silicone adhesive designed for general assembly bonding at operating temperatures up to 200°C. Supplied as an off-white, unfilled paste, it cures via a heat-activated schedule and offers approximately seven times the thermal conductivity of unfilled silicone adhesives. The adhesive is reworkable after cure, supporting rework or rework-sensitive assembly processes. It is packaged in metal squeeze tubes for dispensing and is intended for applications where thermal management and temperature-resistant bonding are required, with a primer recommended for improved adhesion on certain substrates.

Key features

  • Thermally conductive: Roughly seven times the thermal conductivity of unfilled silicone adhesives.
  • Reworkable: Cured bonds can be reworked, supporting rework and rework-sensitive assembly.
  • High-temperature capability: Rated for continuous operating temperatures up to 200°C.

Applications / Suitable for: General assembly bonding where heat resistance and thermal conductivity are required.

Product Family

ABLESTIK 12-1

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Off - White
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
12 °C
Thermal ConductivityThermal Conductivity
1.3 W/m.K
Electrical Properties
Volume ResistivityVolume Resistivity
1000000000000000 Ohms⋅cm

Additional Information

Technical properties

After-processing / final-state properties

Typical properties of the fully cured material after the recommended cure schedule.

Property Value Unit Method / condition
Hardness 90 Shore A Cured material
Glass transition temperature (Tg) 12 °C By TMA
Coefficient of thermal expansion, below Tg 55 ppm/°C TMA
Coefficient of thermal expansion, above Tg 150 ppm/°C TMA
Thermal conductivity 1.3 W/(m·K) @ 121°C
Volume resistivity 1×10¹⁴ ohm·cm Cured material
Lap shear strength 2.07 (300) N/mm² (psi) Aluminum-to-aluminum, 25°C

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